SNAPDRAGON 8 GEN 3 is packed 🔥....
Credit: Qualcomm
The SD 8 Gen 3 is a powerful and versatile mobile platform that delivers exceptional performance, features, and connectivity for smartphones and other devices. It is the first platform to support generative AI models with up to 10 billion parameters on-device, enabling stunning creativity and intelligence. It also boasts a 30% faster CPU, a 25% faster GPU, a 40% better ray tracing engine, and a 2.5x AI processing power at the hardware level. It also offers a 240Hz display, a lossless audio over Wi-Fi using XPAN, and a best-in-class 5G modem-RF system. The SD 8 Gen 3 is the ultimate platform for gaming, entertainment, photography, and productivity.
Specifications
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name: Qualcomm® Adreno™
CPU Name: Qualcomm® Kryo™
Qualcomm® Sensing Hub Features: Dual-core AI processor, Dual always-sensing cameras
CPU (4nm lithography)
Name: Qualcomm® Kryo™
Architecture: 64-bit
Clock Speed: 3.3 GHz
GPU
Name: Qualcomm® Adreno™
APIs: OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan® 1.3
Cellular Modem-RF
Modem Name: Snapdragon™ X75 5G Modem-RF System
Peak Download Speed: 10 Gbps
Peak Upload Speed: 3.5 Gbps
Cellular Technology: sub-6 GHz, HSPA, TDD, LTE, WCDMA, FDD, SA (standalone), NSA (non-standalone), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE, EN-DC, CBRS, NR-DC (mmWave-sub6 dual connectivity), SA (standalone) mmWave, mmWave
Wi-Fi
Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 7800
Peak Speed: 5.8 Gbps
Generation: Wi-Fi 7, Wi-Fi 6, Wi-Fi 5, Wi-Fi 4
Standards: 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Spectral Bands: 6 GHz, 5 GHz, 2.4 GHz
Channels: 320 MHz
Peak QAM: 4K QAM
Bluetooth
Specification Version: Bluetooth® 5.4
Connection Technology: Bluetooth® Low Energy
Location
Location Support: Qualcomm® Location Suite
Satellite Systems: Galileo, Beidou, NavIC, GPS, GLONASS, QZSS
Frequency Support: Triple
Accuracy: Sidewalk-level, Lane-level
Features: Pedestrian Navigation, Global Freeway Vehicle Navigation, Concurrent satellite systems
NFC
Near Field Communications: Supported
Camera
Image Signal Processor (ISP) Name: Qualcomm® Spectra™
Image Signal Processor (ISP) Type: Hardware Accelerator for Computer Vision (CV-ISP), Cognitive ISP (Cog ISP), Image Signal Processor (ISP)
Image Signal Processor (ISP) Number: Triple ISP
Image Signal Processor (ISP) Bit Depth: 18-bit
Triple Camera (MFNR, ZSL, 30 fps): 36 MP
Dual Camera (MFNR, ZSL, 30 fps): 64+36 MP
Single Camera (MFNR, ZSL, 30 fps): 108 MP
Single Camera: 200 MP
Features: Mega Low light photography, AI-based auto-exposure, AI-based auto-focus, AI-based face detection, Engine for Visual Analytics 3.0, Multi-frame Noise Reduction (MFNR), Locally Motion Compensated Temporal Filtering (MCTF), Real-time Semantic Segmentation, Truepic photo capture
Video Capture: 8K 30fps or 4K 120fps video capture
Slow Motion Video Capture: 720p @ 960 fps
Video Capture Formats: Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+, Google Ultra HDR
Video Capture Features: 4 exposures (with QDOL image sensors), Engine for Visual Analytics 3.0, Video super resolution, Computational HDR with staggered imaged sensors, Bokeh Engine (version 2), Real-time Semantic Segmentation
Video Playback
Resolution: 8K @ 60 fps
Codecs: H.265 (High Efficiency Video Coding (HEVC)), HDR10, Hybrid Log Gamma (HLG), Dolby Vision®, HDR10+, H.264 (Advanced Video Coding (AVC)), VP8, VP9, AV1
Features: HDR Vivid
Display
Maximum On-Device Display Resolution: 4K Ultra HD @ 60 Hz, QHD+ @ 144 Hz
Maximum External Display Resolution: 8K @ 30 Hz
High Dynamic Range (HDR): HDR Vivid, HDR10, HDR10+
Color Depth: 10-bit
Color Gamut: Rec. 2020
Audio
Qualcomm Aqstic™ technology support: Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier
Qualcomm® aptX™ audio technology support: Qualcomm® aptX™ Lossless, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive
Audio Processing Technologies: Snapdragon Sound™ technology
Charging
Qualcomm® Quick Charge™ technology support: Qualcomm® Quick Charge™ 5 technology
Security
Fingerprint Sensor: Qualcomm® 3D Sonic Sensor, Qualcomm® 3D Sonic Sensor Max
Secure Processing Unit (SPU): Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Iris), Biometric Authentication (Voice)
Memory
Speed: 4.8 GHz
Type: LPDDR5x
Interface Type: USB-C
Specification Version: USB 3.1 Gen2
Storage
UFS: UFS 4.0
All the details are from the official Qualcomm webiste.
All the details are from the official Qualcomm webiste.
References :
Comments
Post a Comment